The manufacturing process of the printed circuit board includes the following steps
Designing
The specific initial phase in making a printed circuit board is designing of the board. Like every made product, circuit boards require an arrangement. Contingent upon your prerequisites for the elements of the board, the designer can make and structure an appropriate format utilizing industry Computer Aided Design software. The absolute most mainstream CAD software incorporates; OrCAD, Altium, and Eagle.
Laser Printing
This procedure plans for the making of the printed circuit board. Utilizing laser printers, the maker makes negative photograph movies of the circuit board and parts. The last photograph is in dark ink and each layer of the printed circuit board has their own film sheet. The dark regions indicate where the conductive materials are and the reasonable zones demonstrate where the non-conductive materials are. These are utilized to demonstrate the alignments of the printed circuit board.
Preparing
The base material for a circuit board is normally covered as it is perfect for use with copper. The overlay board is gone through cleaning and gets ready with a layer of photograph opposes film. The film is put over the cover board with pins that hold the sheet into place. The board is then presented to UV light which goes through the reasonable parts of the film to solidify the material that isn't conductive. The dark piece of the film shields the UV light from solidifying the conductive parts.
Etching
Etching procedure expels undesirable copper from the board. There are a few different ways to remove copper; however, the most regularly utilized technique is by utilizing a solid substance. The solid substance at that point evacuates the overabundance copper and you are left with the copper that is ensured under the photograph oppose film. After the evacuation of undesirable copper, the board is presented to another concoction to expel the dark zones and leave a sparkling finishing on the PCB.
Drilling
The drilling procedure prepares the parts for connection to the circuit board through penetrating exact holes on the board. As the drilling apparatus is little, a PC is utilized to control the development of the bore to guarantee precision. In high-volume production, robotized drilling machines are utilized to spare time. This procedure can take a while as the normal circuit board has in excess of one hundred points to penetrate.
Plating
In the plating procedure, the external layer of the circuit board houses the copper connections which can't be soldered. To make the copper associations reasonable for fastening, the surface is plated with gold, nickel or tin. To secure alternate regions that ought not to be fastened, a concealing material is utilized. This concealing material is a sort of polymer covering which can keep short-circuiting from the traces of solder.
Testing
As a major aspect of the quality check and affirmation, a specialist does a few checks and electrical tests on the printed circuit board. There are a few techniques for testing the usefulness of a PCB and most tests incorporate the utilization of PC projects to apply little measures of voltage to each conductive point. This is to check if the circuit board is working not surprisingly and if it complies with the first structures.