SILICONE FILLING COMPOUND 029|2PACK
SILICONE FILLING COMPOUND 029|Liquid filling, Thermal conductivity, Electronic component
The product is a liquid filling, two-component material is hardening occurs at room temperature. The compound provides thermal conductivity and low expansion and is ideal for pouring or filling joints in heat-generating electronic components with metal housings or radiators. It has an excellent fluency at dosing and filling. After hardening, it does not tear off as a result of cyclic heating from a surface, to which it is attached. The hardened product is dry to the touch.
-Encapsulation of electronic/electrical systems.
-Computers and peripheral devices.
-The application of condensation filling compound in a closed system can cause the occurrence of unharmful white coating, which does not influence the operation of the system.